MULTILAYER PCBS

 

PRODUCTION CAPABILITY
Type of Laminates FR-4, FR-4 (High TG).
Laminate Thickness 0.8 to 3.2 (mm)
Finish Copper Thickness (IL) Up to 105 microns
Finish Copper Thickness (OL) Up to 210 microns
Maximum PCB Size 600 mm x 500 mm
Minimum Track Width 0.10 mm ( 4 mil )
Minimum Track Spacing 0.10 mm ( 4 mil )
Minimum Hole Diameter 0.15 mm
Hole/ Outer Profile CNC Drilling & CNC Routing
Surface Finishing ENIG, Gold Plating (Hard Gold), Lead Free HASL, HASL.
Special Finishes Carbon Printed Contacts, Peelable Mask.
Specifications. Standards IPC-A-600, IPC-SM-840, IPC-RB-276, IPC-TM-650
Reports PDIR, Microsection, Solderability, FAI (First Article Inspection), PPAP Documents (On specific request)
System Approvals IATF 16949:2016, ISO 9001:2015, ROHS Compliance
Category:

Description

MULTILAYER PCBS

Production Capacity :-  700 sqm / month

Sector Catered : Automotive, Lighting, Industrial Electronics, Home Appliances, Railways, Power Electronics, Automation, Storage Devices, Solar Systems.